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Proceedings Paper

Through-process modeling in a DfM environment
Author(s): Scott Mansfield; Geng Han; Mohamed Al-Imam; Rami Fathy
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Paper Abstract

In recent years, design for manufacturability (DfM) has become an important focus item of the semiconductor industry and many new DfM applications have arisen. Most of these applications rely heavily on the ability to model process sensitivity and here we explore the role of through-process modeling on DfM applications. Several different DfM applications are examined and their lithography model requirements analyzed. The complexities of creating through-process models are then explored and methods to ensure their accuracy presented.

Paper Details

Date Published: 14 March 2006
PDF: 11 pages
Proc. SPIE 6156, Design and Process Integration for Microelectronic Manufacturing IV, 615603 (14 March 2006); doi: 10.1117/12.658049
Show Author Affiliations
Scott Mansfield, IBM Microelectronics (United States)
Geng Han, IBM Microelectronics (United States)
Mohamed Al-Imam, Mentor Graphics Corp. (Egypt)
Rami Fathy, Mentor Graphics Corp. (Egypt)


Published in SPIE Proceedings Vol. 6156:
Design and Process Integration for Microelectronic Manufacturing IV
Alfred K. K. Wong; Vivek K. Singh, Editor(s)

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