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Proceedings Paper

Fundamental parameter extraction for a dry/immersion hybrid photoresist for contact hole applications
Author(s): Stewart A. Robertson; Shintaro Yamada; Joanne M. Leonard
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Paper Abstract

EPICTM 2330 photoresist is an imaging material designed for conventional dry and immersion ArF exposure, its formulation is optimized for contact hole features. Although it performs well in both imaging modes, with good profile, it is not known whether the presence of water impacts the materials fundamental imaging characteristics. Acid generation efficiency, characteristic acid diffusion length and dissolution rates are determined for EPIC 2330 under dry and immersion imaging conditions. The results show, that within measurement errors, no difference is observed for these fundamental parameters whether water is present during exposure, or not.

Paper Details

Date Published: 29 March 2006
PDF: 8 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 615312 (29 March 2006); doi: 10.1117/12.658030
Show Author Affiliations
Stewart A. Robertson, Rohm and Haas Electronic Materials (United States)
Shintaro Yamada, Rohm and Haas Electronic Materials (United States)
Joanne M. Leonard, Rohm and Haas Electronic Materials (United States)

Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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