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Proceedings Paper

The EUV resist test center at SEMATECH-North
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Paper Abstract

The availability of photoresists meeting simultaneous resolution, sensitivity, and line edge roughness performance is a critical challenge for the acceptance of Extreme Ultraviolet Lithography. The Extreme Ultraviolet Resist Test Center (EUV RTC) at SEMATECH-North at the State University of New York at Albany is a state of the art facility to support the development of photoresists for EUV lithography. The facility was opened on September 28, 2005, for customer use. SEMATECH researchers, member companies, resist suppliers, and researchers from universities and institutes worldwide can use this neutral site for EUV resist development. The heart of the EUV RTC is an Exitech 5X EUV microstepper with a 0.3 numerical aperture (NA) lens. This tool has successfully imaged 45 nm dense lines in photoresists, and the ultimate imaging performance of the microstepper based on optics and wavefront quality should be near 25nm dense lines.

Paper Details

Date Published: 24 March 2006
PDF: 7 pages
Proc. SPIE 6151, Emerging Lithographic Technologies X, 61512U (24 March 2006); doi: 10.1117/12.657683
Show Author Affiliations
Klaus Lowack, SEMATECH North (United States)
Andy Rudack, SEMATECH North (United States)
Kim Dean, SEMATECH (United States)
Matt Malloy, SEMATECH North (United States)
Mike Lercel, SEMATECH (United States)


Published in SPIE Proceedings Vol. 6151:
Emerging Lithographic Technologies X
Michael J. Lercel, Editor(s)

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