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Proceedings Paper

Simulation analysis of printability of scratch and bump defects in EUV lithography
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Paper Abstract

This study investigated what impact smoothing and non-smoothing deposition have on printability on a wafer for scratch and bump defects. For bump defects, smoothing deposition does not widen a defect and provides a comparatively large allowable size. In contrast, for scratch defects it widens a defect from the bottom to the top of the multilayer when mass is conserved in every monolayer. The expansion of a scratch defect markedly degrades the quality of a printed image on a wafer. For scratch defects, a detailed evaluation of the light intensity distributions on both the mask and wafer surfaces, and the diffracted-light distribution, was carried out to investigate how smoothing deposition degrades image quality. It was concluded that, for scratch defects, the energy loss at the pupil degrades the image quality on a wafer, since weak diffraction peaks produced by the defect spread through all diffraction orders. Besides the allowable size of bump, scratch, and pit defects was determined using the criterion of a maximum CD variation of 10%.

Paper Details

Date Published: 23 March 2006
PDF: 10 pages
Proc. SPIE 6151, Emerging Lithographic Technologies X, 61510W (23 March 2006); doi: 10.1117/12.657640
Show Author Affiliations
Minoru Sugawara, Association of Super-Advanced Electronic Technologies (Japan)
Iwao Nishiyama, Association of Super-Advanced Electronic Technologies (Japan)

Published in SPIE Proceedings Vol. 6151:
Emerging Lithographic Technologies X
Michael J. Lercel, Editor(s)

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