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Proceedings Paper

Integrated aerial image sensor: modeling and assembly
Author(s): Jing Xue; Kurt Moen; Costas J. Spanos
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Paper Abstract

Earlier work describes the concept and the design of the Integrated Aerial Image Sensor (IAIS) [1]. This paper focuses on the first principle modeling and the physical construction of the IAIS. Our modeling is based on Abbe's formulation. Assuming a partially coherent illumination source, the partial, total and final detector images are obtained through optical system simulations, combined with a wafer-plane aperture mask simulation, using software provided by Panoramic. The performance of the IAIS under different lithography settings can be predicted accordingly. Our intent is to create a library that captures the aerial image to detector image correspondence in order to facilitate rapid analysis. We also examine several approaches towards the integration of CCD chips onto the test wafer substrate. Although there are several issues that still need to be resolved, a low temperature bonding scheme involving capillary force assisted alignment appears quite promising and is being discussed in some detail.

Paper Details

Date Published: 24 March 2006
PDF: 8 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615221 (24 March 2006); doi: 10.1117/12.656976
Show Author Affiliations
Jing Xue, Univ. of California/Berkeley (United States)
Kurt Moen, Univ. of California/Berkeley (United States)
Costas J. Spanos, Univ. of California/Berkeley (United States)


Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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