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Proceedings Paper

Impact of multi-layer deposition method on defects for EUVL photomask blanks
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Paper Abstract

This paper is a summary of the work to date done by the ASET consortia to look at the impact of deposition method on defects. The study includes scratch and bump type defects coated with EUVL quality multi-layers using Magnetron Sputtering, Ion Beam Sputtering, or Ion Beam Sputtering with a secondary ion etch. After the deposition TEM samples were taken of the individual defects and the impact of the deposition method on the multi-layers was examined.

Paper Details

Date Published: 23 March 2006
PDF: 9 pages
Proc. SPIE 6151, Emerging Lithographic Technologies X, 61511X (23 March 2006); doi: 10.1117/12.656931
Show Author Affiliations
Jerry Cullins, Association of Super-Advanced Electronics Technologies (Japan)
Kumi Motai, Association of Super-Advanced Electronics Technologies (Japan)
Iwao Nisiyama, Association of Super-Advanced Electronics Technologies (Japan)

Published in SPIE Proceedings Vol. 6151:
Emerging Lithographic Technologies X
Michael J. Lercel, Editor(s)

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