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Proceedings Paper

Overlay improvement by using new framework of grid compensation for matching
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Paper Abstract

Overlay accuracy is a key issue in the semiconductor manufacturing process. To achieve overlay requirements, we developed compensation functions, i.e. Enhanced Global Alignment (EGA), Super Distortion Matching (SDM), and Grid Compensation for Matching (GCM). These functions are capable to reduce all the components except local linear components caused by a wafer global deformation. In this paper we introduce a novel correction framework which includes new compensation function called Shot Correction by Grid Parameter; thereby enabling further enhancements to overlay. Using this novel framework, we show both simulation and experimental data demonstrating improved overlay accuracy.

Paper Details

Date Published: 24 March 2006
PDF: 8 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61523A (24 March 2006); doi: 10.1117/12.656876
Show Author Affiliations
Ayako Sukegawa, Nikon Corp. (Japan)
Shinji Wakamoto, Nikon Corp. (Japan)
Shinichi Nakajima, Nikon Corp. (Japan)
Masaharu Kawakubo, Nikon Corp. (Japan)
Nobutaka Magome, Nikon Corp. (Japan)


Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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