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Proceedings Paper

The suppression method of powder formation in ArF photoresist
Author(s): Geunsu Lee; Heesung Kim; Eungsok Lee; Myoungsoo Kim; Samyoung Kim; Cheolkyu Bok; Hyeongsoo Kim; Seungchan Moon; Jinwoong Kim
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Paper Abstract

Powder formation of ArF photoresist in nozzle tip of track is very serious problem because particles of photoresist drop on wafer during process. To cope with this issue, we have studied several factors affecting powder formation in ArF photoresist processing such as polymer type, solvent for photoresist, thinner for solvent bath, and the structure of solvent bath. This report shows solutions for this issue. Chemical structure of polymer in ArF photoresist is the origin of powder formation but solvents for photoresist and thinner for solvent bath have an important role for improvement. Above all, the modification of solvent bath structure is most effective to remove this issue.

Paper Details

Date Published: 29 March 2006
PDF: 7 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 61533F (29 March 2006); doi: 10.1117/12.656860
Show Author Affiliations
Geunsu Lee, Hynix Semiconductor Inc. (South Korea)
Heesung Kim, Hynix Semiconductor Inc. (South Korea)
Eungsok Lee, Hynix Semiconductor Inc. (South Korea)
Myoungsoo Kim, Hynix Semiconductor Inc. (South Korea)
Samyoung Kim, Hynix Semiconductor Inc. (South Korea)
Cheolkyu Bok, Hynix Semiconductor Inc. (South Korea)
Hyeongsoo Kim, Hynix Semiconductor Inc. (South Korea)
Seungchan Moon, Hynix Semiconductor Inc. (South Korea)
Jinwoong Kim, Hynix Semiconductor Inc. (South Korea)


Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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