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Proceedings Paper

Study of critical dimension and overlay measurement methodology using SEM image analysis for process control
Author(s): Tae Yong Lee; Byoung Ho Lee; Soo Bok Chin; Young Sun Cho; Jun Sik Hong; Jong Seo Hong; Chang Lyong Song
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Paper Abstract

As the design rule of semiconductor devices shrinks to below 100nm dimensions, the degree of pattern alignment from different process levels has become a crucial factor affecting both process control and induced defect on unit process. Isolated and dense patterns were formed at process layers from front-end through to back-end on wafers using sub 100nm device process utilizing ArF lithography under various lithography conditions. As pattern size is reduced, overlay discrepancies become larger. The OL (overlay) error is very important because the pattern misalignment induces critical defects for the device. For many years, overlay metrology for process control has been measured by 4-corner box-in-box methods in chip. OL errors and CD (Critical Dimension) values have been measured on different tool. CD values have been measured on SEMs (Scanning Electron Microscope) and OL errors have been measured on optical tools. The accuracy of OL error metrology is limited by the resolution of tool, which is on the order of 1μm. In this paper we calculated the degree of overlay errors (current level to prior level errors) through a process patterns images obtained from a CD-SEM.

Paper Details

Date Published: 24 March 2006
PDF: 8 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61522E (24 March 2006); doi: 10.1117/12.656736
Show Author Affiliations
Tae Yong Lee, Samsung Electronics Co. Ltd. (South Korea)
Byoung Ho Lee, Samsung Electronics Co. Ltd. (South Korea)
Soo Bok Chin, Samsung Electronics Co. Ltd. (South Korea)
Young Sun Cho, Samsung Electronics Co. Ltd. (South Korea)
Jun Sik Hong, Samsung Electronics Co. Ltd. (South Korea)
Jong Seo Hong, Samsung Electronics Co. Ltd. (South Korea)
Chang Lyong Song, Samsung Electronics Co. Ltd. (South Korea)


Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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