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Proceedings Paper

Yield enhancement methodologies for 90-nm technology and beyond
Author(s): John Allgair; Todd Carey; James Dougan; Tony Etnyre; Nate Langdon; Brooke Murray
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Paper Abstract

In order to stay competitive in the rapidly advancing international semiconductor industry, a manufacturing company needs to continually focus on several areas including rapid yield learning, manufacturing cost, statistical process control limits, process yield, equipment availability, cycle time, turns per direct labor hour, customer on time delivery and zero customer defects. To hold a competitive position in the semiconductor market, performance to these measurable factors mut be maintained regardless of the technology generation. In this presentation, the methodology applied by Freescale Semiconductor to achieve the fastest yield learning curve in the industry, as cited by Dr. Robert Leachman of UC Berkley in 2003, will be discussed.

Paper Details

Date Published: 24 March 2006
PDF: 8 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615208 (24 March 2006); doi: 10.1117/12.656616
Show Author Affiliations
John Allgair, Freescale Semiconductor (United States)
Todd Carey, Freescale Semiconductor (United States)
James Dougan, Freescale Semiconductor (United States)
Tony Etnyre, Freescale Semiconductor (United States)
Nate Langdon, Freescale Semiconductor (United States)
Brooke Murray, Freescale Semiconductor (United States)


Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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