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Proceedings Paper

Integrated electrostatic microsensors for the development of modeling techniques of defects in the actuation of large micro-electromechanical systems (MEMS)
Author(s): Timothy Reissman; Ephrahim Garcia; Nicolae Lobontiu; Yoonsu Nam
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Paper Abstract

A micro-electromechanical system (MEMS) was designed by following the saggital principle of motion amplification about an output direction which is perpendicular to the input direction. Several displacement-amplification microdevices have been fabricated by means of the PolyMUMPS microtechnology. The experimental testing of these electrostatically-actuated, electrostatically-sensed micromechanisms monitored the output motion by means of a highly-compliant, integrated cantilever, as well as by a vernier system, and revealed that the performance is less than predicted, in some occasions the errors between the defect-free model predictions and the experimental results being quite substantial. This system integration, sensory monitored discrepancy lead the effort of identifying and quantifying the influence of various factors in the less-than-expected response of these compliant micromechanisms. Discussed are the effect of non-parallel disposition of the mobile structure with respect to its substrate, the non-planar shape of the microdevice, which produces at times rubbing or adhesion against the substrate, various misalignments between fixed and mobile components, as well the resulting fringe effects, which sizably hamper the operation of the comb or plate electrostatic sensory actuation. It is demonstrated that by combining all these unwanted effects, which are either inherent to the small-dimensions microdevice, or are simply errors of the microfabrication process, it is possible to account for the experimentally-observed response and create a predictive error-inclusive model of the system.

Paper Details

Date Published: 24 March 2006
PDF: 9 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615238 (24 March 2006); doi: 10.1117/12.656582
Show Author Affiliations
Timothy Reissman, Cornell Univ. (United States)
Ephrahim Garcia, Cornell Univ. (United States)
Nicolae Lobontiu, Technical Univ. of Cluj-Napoca (Romania)
Yoonsu Nam, Kangwon National Univ. (South Korea)

Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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