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Proceedings Paper

Characterization and applications of an in-scanner aerial image detection system
Author(s): S. Hunsche; M. J. Gassner; J. A. Schefske; E. R. Kent; A. Acheta
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Paper Abstract

We have developed and proven the viability of a system for massively parallel in-situ sampling of aerial images at the actual wafer plane of a 193nm production scanner, using a wafer-like high-resolution image sensor. The sensor and scanner can be operated under exact production conditions in terms of projection optics, all illumination conditions, laser wavelength and bandwidth, so that the sensor will be sensitive to all effects arising from the interaction of an actual scanner with an actual reticle. We demonstrate the basic image capturing operation of the sensor, using more than 400,000 sampling points across the exposure field, and fundamental capabilities of the system. These include generation of focus maps, line width measurements on the sensor images, sensitivity to sub-resolution features, sensitivity to aberrations, and excellent agreement between experimental data and simulation.

Paper Details

Date Published: 24 March 2006
PDF: 11 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61522U (24 March 2006); doi: 10.1117/12.656547
Show Author Affiliations
S. Hunsche, Brion Technologies, Inc. (United States)
M. J. Gassner, Brion Technologies, Inc. (United States)
J. A. Schefske, Spansion LLC (United States)
E. R. Kent, Spansion LLC (United States)
A. Acheta, Spansion LLC (United States)


Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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