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Proceedings Paper

Supercritical CO2 for high-resolution photoresist development
Author(s): Nelson Felix; Kousuke Tsuchiya; Camille Man Yin Luk; Christopher K. Ober
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Paper Abstract

Today's conventional microelectronic fabrication processes are able to produce features in the 100nm range or lower. However, tighter regulation of toxic chemical release, as well as the increasing energy cost associated with treating rinse water, means that the semiconductor industry is primed for the adoption of alternative solvent processes. Supercritical CO2 (scCO2) is a promising candidate as a replacement solvent. It is inexpensive, environmentally benign, combines the best properties of both a gas and liquid and can be easily separated from solutes. We have recently shown scCO2 to be a prime replacement solvent for photoresist development, and have formulated photoresists for both positive and negative tone development processes. We demonstrate the solubility of small non-polymeric, molecular glass compounds in supercritical CO2. Molecular glasses form amorphous films on planar substrates and may show excellent solubility in scCO2 without the incorporation of fluorine or silicon. Using a phenolic molecular glass, line-space features of 50 nm were developed in scCO2.

Paper Details

Date Published: 29 March 2006
PDF: 8 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 61534B (29 March 2006); doi: 10.1117/12.656523
Show Author Affiliations
Nelson Felix, Cornell Univ. (United States)
Kousuke Tsuchiya, Tokyo Institute of Technology (Japan)
Camille Man Yin Luk, Cornell Univ. (United States)
Christopher K. Ober, Cornell Univ. (United States)


Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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