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Proceedings Paper

High-resistance W-plug monitoring with an advance e-beam inspection system
Author(s): Hermes Liu; J. H. Yeh; Chan Lon Yang; S. C. Lei; J. Y. Kao; Y. D. Yang; Mingsheng Tsai; S. F. Tzou; Wei-Yih Wu; Hong-Chi Wu; Hong Xiao; Jack Jau
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Paper Abstract

Dark voltage contrast (DVC) defects are detected on normally bright tungsten plugs (W-plugs) during the in-line e-beam inspection step. Cross-sectional scanning electron microscope (SEM) and transmission electron microscope (TEM) in a failure analysis (FA) lab verified that DVC defects with different gray level values (GLV) are caused by different resistances of the W-plugs. We found that DVC defects with lower GLV (GLV1) are W-plugs that are open or almost open. DVC defects with higher GLV GLV2 are caused by partially open W-plugs and in-plug voids. Wafer acceptance test (WAT) results correlated well with e-beam inspection results.

Paper Details

Date Published: 24 March 2006
PDF: 9 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61524A (24 March 2006); doi: 10.1117/12.656217
Show Author Affiliations
Hermes Liu, United Microelectronics Corp. (Taiwan)
J. H. Yeh, United Microelectronics Corp. (Taiwan)
Chan Lon Yang, United Microelectronics Corp. (Taiwan)
S. C. Lei, United Microelectronics Corp. (Taiwan)
J. Y. Kao, United Microelectronics Corp. (Taiwan)
Y. D. Yang, United Microelectronics Corp. (Taiwan)
Mingsheng Tsai, United Microelectronics Corp. (Taiwan)
S. F. Tzou, United Microelectronics Corp. (Taiwan)
Wei-Yih Wu, Hermes Systems (Taiwan)
Hong-Chi Wu, Hermes Systems (Taiwan)
Hong Xiao, Hermes Microvision, Inc. (United States)
Jack Jau, Hermes Microvision, Inc. (United States)


Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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