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Proceedings Paper

An in-line image quality monitoring system for imaging device fabrication using automated macro-inspection
Author(s): Tohru Sasaki; Kunihiko Hikichi; Dai Sugimoto; Nozomu Izumi; Mitsuru Uda; Atsushi Kohayase; Hiroshi Yamashita
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Paper Abstract

An in-line image quality monitoring system using automated macro-inspection is described. One of the critical problems in reducing yield in CCD manufacture is the production of mura, regions of uneven sensitivity in the device. In this paper, an in-line mura-related yield monitor is presented using the recently developed Tokyo Aircraft Instrument Company EDIS-3000 Automated Macro-Inspection system, which has a high sensitivity and a high resolution optical module developed by IBMTM Japan. The optical module is designed to focus on reflected light from the pattern edge, not on the traditional diffracted light, so it is expected to register the linearity between the wafer CD and the wafer image. This system is expected to reduce yield loss, resulting in a faster time-to-market for imaging devices.

Paper Details

Date Published: 24 March 2006
PDF: 10 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 61522W (24 March 2006); doi: 10.1117/12.656151
Show Author Affiliations
Tohru Sasaki, Sony Corp. (Japan)
Kunihiko Hikichi, Sony Corp. (Japan)
Dai Sugimoto, Sony Corp. (Japan)
Nozomu Izumi, Sony Corp. (Japan)
Mitsuru Uda, IBM Japan (Japan)
Atsushi Kohayase, IBM Japan (Japan)
Hiroshi Yamashita, IBM Japan (Japan)

Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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