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Proceedings Paper

Evaluation of 193nm immersion resist without topcoat
Author(s): Yayi Wei; N. Stepanenko; A. Laessig; L. Voelkel; M. Sebald
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Paper Abstract

193nm immersion resist without topcoat is production preferred solution. The challenge of 193nm immersion resist is both low leaching level and high performance. This paper summarizes the screening results of selected 193nm immersion resists which are designed for use without top coatings. Our evaluation is divided into several phases. Leaching levels of resist samples were first tested. The leaching data were analyzed and compared to our specifications. Both binary image mask and alternating phase-shift mask exposures were done to evaluate the process window, line-edge roughness, and resist pattern profile. Resist films were rinsed by DI water prior to or after exposure, and contrast curves were measured to investigate the resist sensitivity change. The results are compared with resist systems which use developer-soluble topcoats.

Paper Details

Date Published: 29 March 2006
PDF: 11 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 615305 (29 March 2006); doi: 10.1117/12.655664
Show Author Affiliations
Yayi Wei, Infineon Technologies North America Corp. (United States)
N. Stepanenko, Infineon Technologies SC300 GmbH & Co. (Germany)
A. Laessig, Infineon Technologies SC300 GmbH & Co. (Germany)
L. Voelkel, Infineon Technologies SC300 GmbH & Co. (Germany)
M. Sebald, Infineon Technologies AG (Germany)


Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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