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Proceedings Paper

Evaluation of most recent chemically amplified resists for high resolution direct write using a Leica SB350 variable shaped beam writer
Author(s): Anatol Schwersenz; Dirk Beyer; Monika Boettcher; Kang-Hoon Choi; Ulrich Denker; Christoph Hohle; Mathias Irmscher; Frank-Michael Kamm; Karl-Heinz Kliem; Johannes Kretz; Holger Sailer; Frank Thrum
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Paper Abstract

E-beam direct writing, one node ahead of advanced optical lithography, can be a time and cost effective option for early device and technology development as well as for fast prototyping. Because of the device complexity only a variable-shaped e-beam writer combined with sensitive chemically amplified resists (CAR) can be considered for this approach. We evaluated various pCARs and nCARs of all major suppliers for our goal to structure DRAMs of the 50nm node using the Leica SB350 e-beam writer. The most promising samples were selected for a process optimization by variation of bake and development conditions. Finally, one resist of each tonality met the most of our specifications like dense lines and contact holes resolution, sensitivity and vacuum stability.

Paper Details

Date Published: 29 March 2006
PDF: 12 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 615347 (29 March 2006); doi: 10.1117/12.655497
Show Author Affiliations
Anatol Schwersenz, IMS Chips (Germany)
Dirk Beyer, Leica Microsystems Lithography (Germany)
Monika Boettcher, Leica Microsystems Lithography (Germany)
Kang-Hoon Choi, Infineon Technologies Dresden GmbH & Co. OHG (Germany)
Ulrich Denker, Leica Microsystems Lithography (Germany)
Christoph Hohle, Infineon Technologies AG (Germany)
Mathias Irmscher, IMS Chips (Germany)
Frank-Michael Kamm, Infineon Technologies Dresden GmbH & Co. OHG (Germany)
Karl-Heinz Kliem, Leica Microsystems Lithography (Germany)
Johannes Kretz, Infineon Technologies Dresden GmbH & Co. OHG (Germany)
Holger Sailer, IMS Chips (Germany)
Frank Thrum, Infineon Technologies Dresden GmbH & Co. OHG (Germany)

Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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