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Proceedings Paper

Parameter investigation of PEB sensitivity
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Paper Abstract

Post exposure bake temperature sensitivity (PEB sensitivity) becomes important as the pattern pitch size shrinks gradually. There are several factors affecting the PEB sensitivity including acidity and diffusion of photogenerated acid, activation energy for deprotection reaction, free volume of base polymer, and so on. Our works were conducted as a part of the basic study for searching influential parameter of PEB sensitivity. We found that PEB sensitivity relies largely on not only acid diffusion parameter, but also the hydrophilicity of base polymer and protection group ratio. Also, we observed that bulkiness of deprotection group has great influence on PEB sensitivity. Detailed results will be reported in this paper.

Paper Details

Date Published: 29 March 2006
PDF: 7 pages
Proc. SPIE 6153, Advances in Resist Technology and Processing XXIII, 615335 (29 March 2006); doi: 10.1117/12.655449
Show Author Affiliations
Seung Keun Oh, Dongjin Semichem Co., Ltd. (South Korea)
Eun Kyung Son, Dongjin Semichem Co., Ltd. (South Korea)
Chan Sik Park, Dongjin Semichem Co., Ltd. (South Korea)
Jung Youl Lee, Dongjin Semichem Co., Ltd. (South Korea)
Jeong Woo Kim, Dongjin Semichem Co., Ltd. (South Korea)
Jae Woo Lee, Dongjin Semichem Co., Ltd. (South Korea)
Deog Bae Kim, Dongjin Semichem Co., Ltd. (South Korea)
Jaehyun Kim, Dongjin Semichem Co., Ltd. (South Korea)
Geunsu Lee, Hynix Semiconductor, Inc. (South Korea)
Seung-Chan Moon, Hynix Semiconductor, Inc. (South Korea)


Published in SPIE Proceedings Vol. 6153:
Advances in Resist Technology and Processing XXIII
Qinghuang Lin, Editor(s)

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