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Proceedings Paper

Electronic-photonic integrated circuits on the CMOS platform
Author(s): L. C. Kimerling; D. Ahn; A. B. Apsel; M. Beals; D. Carothers; Y.-K. Chen; T. Conway; D. M. Gill; M. Grove; C.-Y. Hong; M. Lipson; J. Liu; J. Michel; D. Pan; S. S. Patel; A. T. Pomerene; M. Rasras; D. K. Sparacin; K.-Y. Tu; A. E. White; C. W. Wong
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Paper Abstract

The optical components industry stands at the threshold of a major expansion that will restructure its business processes and sustain its profitability for the next three decades. This growth will establish a cost effective platform for the partitioning of electronic and photonic functionality to extend the processing power of integrated circuits. BAE Systems, Lucent Technologies, Massachusetts Institute of Technology, and Applied Wave Research are participating in a high payoff research and development program for the Microsystems Technology Office (MTO) of DARPA. The goal of the program is the development of technologies and design tools necessary to fabricate an application-specific, electronicphotonic integrated circuit (AS-EPIC). As part of the development of this demonstration platform we are exploring selected functions normally associated with the front end of mixed signal receivers such as modulation, detection, and filtering. The chip will be fabricated in the BAE Systems CMOS foundry and at MIT's Microphotonics Center. We will present the latest results on the performance of multi-layer deposited High Index Contrast Waveguides, CMOS compatible modulators and detectors, and optical filter slices. These advances will be discussed in the context of the Communications Technology Roadmap that was recently released by the MIT Microphotonics Center Industry Consortium.

Paper Details

Date Published: 1 March 2006
PDF: 10 pages
Proc. SPIE 6125, Silicon Photonics, 612502 (1 March 2006); doi: 10.1117/12.654455
Show Author Affiliations
L. C. Kimerling, Massachusetts Institute of Technology (United States)
D. Ahn, Massachusetts Institute of Technology (United States)
A. B. Apsel, Cornell Univ. (United States)
M. Beals, Massachusetts Institute of Technology (United States)
D. Carothers, BAE Systems North America (United States)
Y.-K. Chen, Lucent Technologies (United States)
T. Conway, BAE Systems North America (United States)
D. M. Gill, Lucent Technologies (United States)
M. Grove, BAE Systems North America (United States)
C.-Y. Hong, Massachusetts Institute of Technology (United States)
M. Lipson, Cornell Univ. (United States)
J. Liu, Massachusetts Institute of Technology (United States)
J. Michel, Massachusetts Institute of Technology (United States)
D. Pan, Massachusetts Institute of Technology (United States)
S. S. Patel, Lucent Technologies (United States)
A. T. Pomerene, BAE Systems North America (United States)
M. Rasras, Lucent Technologies (United States)
D. K. Sparacin, Massachusetts Institute of Technology (United States)
K.-Y. Tu, Lucent Technologies (United States)
A. E. White, Lucent Technologies (United States)
C. W. Wong, Columbia Univ. (United States)


Published in SPIE Proceedings Vol. 6125:
Silicon Photonics
Joel A. Kubby; Graham T. Reed, Editor(s)

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