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Proceedings Paper

Three-dimensional metrology with side-wall measurement using tilt-scanning operation in digital probing AFM
Author(s): Ken Murayama; Satoshi Gonda; Hajime Koyanagi; Tsuneo Terasawa
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Paper Abstract

We have developed a new measurement techniques employing digital probing with AFM (Atomic Force Microscope) that can examine sidewalls of fine patterns. This new technique employs digital probing operations, such sample-tilt step-in operation, tilt-step-in operation with a sharpened tilted tip, and multi-angle step-in operation with a flared tip. First, we examined the validity of digital probing operation using a carbon nanotube (CNT) tip, showing the measurement repeatability of approximately 1 nm (3σ) on a fine trench pattern with 50 nm width and 300 nm depth. After the slip calculation between the tilted-tip and the sidewall for the new sidewall measurement technique, we measured a perpendicular reference sidewall with two types of operations, namely, tilt-step-in and multi-angle step-in operations. We then obtained 3D images of ArF resist patterns that involved measurement of sidewall surface roughness. Finally, we demonstrated a possibility of extending the technique for measuring denser trench patterns by using sample-tilt method and a tilted CNT tip.

Paper Details

Date Published: 24 March 2006
PDF: 8 pages
Proc. SPIE 6152, Metrology, Inspection, and Process Control for Microlithography XX, 615216 (24 March 2006); doi: 10.1117/12.654346
Show Author Affiliations
Ken Murayama, MIRAI, Association of Super-Advanced Electronics Technologies (Japan)
Satoshi Gonda, MIRAI, National Institute of Advanced Industrial Science and Technology (Japan)
Hajime Koyanagi, MIRAI, Association of Super-Advanced Electronics Technologies (Japan)
Tsuneo Terasawa, MIRAI, Association of Super-Advanced Electronics Technologies (Japan)


Published in SPIE Proceedings Vol. 6152:
Metrology, Inspection, and Process Control for Microlithography XX
Chas N. Archie, Editor(s)

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