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Proceedings Paper

WDM package enabling high-bandwidth optical intrasystem interconnects for high-performance computer systems
Author(s): J. Schrage; Y. Soenmez; T. Happel; U. Gubler; P. Lukowicz; G. Mrozynski
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Paper Abstract

From long haul, metro access and intersystem links the trend goes to applying optical interconnection technology at increasingly shorter distances. Intrasystem interconnects such as data busses between microprocessors and memory blocks are still based on copper interconnects today. This causes a bottleneck in computer systems since the achievable bandwidth of electrical interconnects is limited through the underlying physical properties. Approaches to solve this problem by embedding optical multimode polymer waveguides into the board (electro-optical circuit board technology, EOCB) have been reported earlier. The principle feasibility of optical interconnection technology in chip-to-chip applications has been validated in a number of projects. For reasons of cost considerations waveguides with large cross sections are used in order to relax alignment requirements and to allow automatic placement and assembly without any active alignment of components necessary. On the other hand the bandwidth of these highly multimodal waveguides is restricted due to mode dispersion. The advance of WDM technology towards intrasystem applications will provide sufficiently high bandwidth which is required for future high-performance computer systems: Assuming that, for example, 8 wavelength-channels with 12Gbps (SDR1) each are given, then optical on-board interconnects with data rates a magnitude higher than the data rates of electrical interconnects for distances typically found at today's computer boards and backplanes can be realized. The data rate will be twice as much, if DDR2 technology is considered towards the optical signals as well. In this paper we discuss an approach for a hybrid integrated optoelectronic WDM package which might enable the application of WDM technology to EOCB.

Paper Details

Date Published: 3 March 2006
PDF: 12 pages
Proc. SPIE 6124, Optoelectronic Integrated Circuits VIII, 61240I (3 March 2006); doi: 10.1117/12.652308
Show Author Affiliations
J. Schrage, Siemens SBS C-LAB (Germany)
Y. Soenmez, Univ. of Paderborn/C-LAB (Germany)
T. Happel, Siemens AG (Germany)
U. Gubler, Ctr. Suisse d'Electronique et de Microtechnique SA (Switzerland)
P. Lukowicz, Univ. for Health Sciences, Medical Informatics and Technology (Austria)
G. Mrozynski, Univ. of Paderborn (Germany)


Published in SPIE Proceedings Vol. 6124:
Optoelectronic Integrated Circuits VIII
Louay A. Eldada; El-Hang Lee, Editor(s)

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