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Proceedings Paper

A new laser bonding method of anisotropic conductive films in flat panel display and in semiconductor packaging
Author(s): Gi-Jung Nam; Meong-Hui Seo; Kwang-Hyun Ryu; No-Heung Kwak
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Paper Abstract

Anisotropic conductive films (ACFs) consist of conducting particles and adhesive resins, and have been widely used for packaging technologies in flat panel displays (FPDs) such as liquid crystal displays (LCDs) and plasma display panels (PDPs). Various packaging technologies such as film on glass (FOG), chip on flex (COF) and Chip on glass (COG) using ACFs have been currently carried out by using a hot plate as a heat source for cure. But this method is difficult to meet the requirement of fine pitch capability and to make the flat panel displays smaller, lighter and thinner because of inhomogeneous thermal distribution of hot plate and thermal expansion of a film. New ACF bonding processes by making use of high power diode laser have been proposed and investigated experimentally. Laser ACF bonding is worthy of attention because of a considerable reduction of the total process time due to the rapid reach of curing temperature. Laser ACF bonding also eliminates problem associated with a deterioration of contact reliability due to the thermal expansion caused by the hot plate surface, when temperature is rising

Paper Details

Date Published: 1 March 2006
PDF: 15 pages
Proc. SPIE 6107, Laser-based Micropackaging, 610701 (1 March 2006); doi: 10.1117/12.650573
Show Author Affiliations
Gi-Jung Nam, Institute for Advanced Engineering (South Korea)
Meong-Hui Seo, Institute for Advanced Engineering (South Korea)
Kwang-Hyun Ryu, Institute for Advanced Engineering (South Korea)
No-Heung Kwak, Jettech, Ltd. (South Korea)


Published in SPIE Proceedings Vol. 6107:
Laser-based Micropackaging
Friedrich G. Bachmann; Willem Hoving; Yongfeng Lu; Kunihiko Washio, Editor(s)

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