Share Email Print
cover

Proceedings Paper

Fabrication of a hybrid electrical-optical printed circuit board (EO-PCB) by lamination of an optical printed circuit board (O-PCB) and an electrical printed circuit board (E-PCB)
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We report on the results of our work on the fabrication of a hybrid electrical-optical printed circuit board (EOPCB) by lamination of an optical printed circuit board (O-PCB) and an electrical printed circuit board (EPCB). This is a part of our work on the micro/nano-scale design, fabrication and integration of optical waveguide arrays and devices for optical printed circuit board (O-PCBs) and VLSI micro/nano-photonic integrated circuit application. The integrated circuit layers form the O-PCB, which is to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards. The OPCBs consist of an optical layer containing planar circuits and arrays of waveguides and photonic devices of various dimensions and characteristics and an electrical layer containing electrical circuits of various functions. Here, we laminate the two layers to form an O-PCB. The advantages include the processing simplification, cost reduction, fabrication of compact devices, and reduction of alignment problem among others. The VLSI micro/nano-photonic integrated circuits perform similar functions on a chip scale. We describe the lamination process and examine the characteristics of the laminated EO-PCBs.

Paper Details

Date Published: 28 February 2006
PDF: 10 pages
Proc. SPIE 6126, Photonics Packaging and Integration VI, 61260L (28 February 2006); doi: 10.1117/12.650521
Show Author Affiliations
El-Hang Lee, Inha Univ. (South Korea)
S. G. Lee, Inha Univ. (South Korea)
B. H. O, Inha Univ. (South Korea)
S. G. Park, Inha Univ. (South Korea)
K. H. Kim, Inha Univ. (South Korea)


Published in SPIE Proceedings Vol. 6126:
Photonics Packaging and Integration VI
Allen M. Earman; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top