Share Email Print
cover

Proceedings Paper

Fabrication of an optical-electrical printed circuit board (OE-PCB) by double-side lamination of an embedded polymer waveguide board between two electrical printed circuit boards
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We designed and fabricated an optical-electrical printed circuit board, which we call OE-PCB, by laminating a board of embedded polymer waveguide arrays between two electrical printed circuit boards. The polymer waveguide arrays are molded by embossing technique using a specially designed silicon mold, which can form the optical waveguide arrays and the 45 degree mirrors concurrently. The integrated silicon molds are fabricated by dry etching or wet etching. The layers of the waveguide arrays are sandwiched and laminated between the upper and the lower electrical PCBs to form the OE-PCBs.

Paper Details

Date Published: 3 March 2006
PDF: 7 pages
Proc. SPIE 6124, Optoelectronic Integrated Circuits VIII, 61241A (3 March 2006); doi: 10.1117/12.650100
Show Author Affiliations
Hyun-Shik Lee, Inha Univ. (South Korea)
Shinmo An, Inha Univ. (South Korea)
Beom Hoan O, Inha Univ. (South Korea)
Seung-Gol Lee, Inha Univ. (South Korea)
El-Hang Lee, Inha Univ. (South Korea)


Published in SPIE Proceedings Vol. 6124:
Optoelectronic Integrated Circuits VIII
Louay A. Eldada; El-Hang Lee, Editor(s)

© SPIE. Terms of Use
Back to Top