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Proceedings Paper

Diode laser welding for packaging of transparent micro-structured polymer chips
Author(s): T. Klotzbuecher; M. Letschert; T. Braune; K.-S. Drese; T. Doll
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Paper Abstract

Laser transmission welding in recent years has been established as a versatile method for interconnection of thermoplastics, at least for macroscopic parts. The technology also offers interesting possibilities for packaging of transparent, micro-structured polymer chips, as used for life science or biotechnology applications. A method for transmission welding, based on a diode laser bar in combination with a thin layer of IR-absorbing dye, is introduced, that allows for fast, mask-less welding of two thermoplastic substrates, at least one of which contains micro structures. The process strongly depends on the ratio of the IR-absorbing dye layer thickness to the depth of the microstructures and should be <<1. Detailed results of the absorption of the dye layers as a function of the spin coating parameters used for preparation of the films are presented, including depth profile analysis. It is demonstrated that the formation of good quality weld seams mainly depends on the energy per unit length coupled to the substrate, which is adjustable by the feed rate and the laser power applied. As an example the process window for welding CGE chips made of PMMA, containing 50 μm wide and deep channels, separated by 100 μm wide webs is shown. The applicability of the technology to other polymer chip geometries together with concepts for further improvement is demonstrated.

Paper Details

Date Published: 23 February 2006
PDF: 14 pages
Proc. SPIE 6107, Laser-based Micropackaging, 610704 (23 February 2006); doi: 10.1117/12.649248
Show Author Affiliations
T. Klotzbuecher, Institut für Mikrotechnik Mainz GmbH (Germany)
M. Letschert, Institut für Mikrotechnik Mainz GmbH (Germany)
T. Braune, Institut für Mikrotechnik Mainz GmbH (Germany)
K.-S. Drese, Institut für Mikrotechnik Mainz GmbH (Germany)
T. Doll, Institut für Mikrotechnik Mainz GmbH (Germany)


Published in SPIE Proceedings Vol. 6107:
Laser-based Micropackaging
Friedrich G. Bachmann; Willem Hoving; Yongfeng Lu; Kunihiko Washio, Editor(s)

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