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Proceedings Paper

Reliability testing and qualification of the TeraVicta RF MEMS switch
Author(s): John S. McKillop
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Paper Abstract

This paper presents the results of work by Teravicta Technologies to adapt semiconductor industry standards and practices to the qualification of RF MEMS switch components. This includes an overview of parametric test data including contact resistance and key RF performance indicators (insertion loss, return loss, and isolation) and reliability test results, identification of key failure modes, the development of failure accelerants and accelerated life test procedures, and final qualification results. Although some tests are unique to the RF MEMS switch, the methodology presented here provides a sound starting point for the development of qualification procedures for other MEMS devices.

Paper Details

Date Published: 6 January 2006
PDF: 5 pages
Proc. SPIE 6111, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V, 61110B (6 January 2006); doi: 10.1117/12.648776
Show Author Affiliations
John S. McKillop, TeraVicta Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 6111:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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