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Proceedings Paper

Design and parameter optimization of flip-chip bonder
Author(s): Hyoungsub Shim; Heuiseok Kang; Hoon Jeong; Youngjune Cho; Wansoo Kim; Shinill Kang
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Paper Abstract

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF. In bonding process, the bonding force and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding temperatures are chosen between 25°C to 300°C. The bonding forces are chosen between 5N and 300N. To test the bonding strength, a bonding strength tester was designed and constructed. After the bonding strength test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

Paper Details

Date Published: 5 December 2005
PDF: 8 pages
Proc. SPIE 6048, Optomechatronic Actuators and Manipulation, 60480G (5 December 2005); doi: 10.1117/12.648757
Show Author Affiliations
Hyoungsub Shim, Yonsei Univ. (South Korea)
Korea Institute of Industrial Technology (South Korea)
Heuiseok Kang, Korea Institute of Industrial Technology (South Korea)
Hoon Jeong, Korea Institute of Industrial Technology (South Korea)
Youngjune Cho, Korea Institute of Industrial Technology (South Korea)
Wansoo Kim, BiOptro Co. Ltd. (South Korea)
Shinill Kang, Yonsei Univ. (South Korea)


Published in SPIE Proceedings Vol. 6048:
Optomechatronic Actuators and Manipulation
Kee S. Moon, Editor(s)

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