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Proceedings Paper

Laser-nanostructure interactions and applications for parallel nanomanufacturing
Author(s): Arvind Battula; Dongbing Shao; Yi Lu; Shaochen Chen
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Paper Abstract

An aggressive pursuit for ever decreasing the minimum feature size in modern integrated circuit has lead to various challenges in nanofabrication. Finer feature size is very desirable in microelectronics and other applications for higher performance. However, it is difficult to achieve critical dimensions at sub-wavelength scale using traditional optical lithography techniques due to the optical diffraction limit. We developed several techniques to overcome this diffraction limit and simultaneously achieve massive, parallel patterning. One of the methods involves the principle of optical near-field enhancement between the spheres and substrate when irradiated by a laser beam, for obtaining the nano-features. Nonlinear absorption of the enhanced optical field between the spheres and substrate sample was believed to be the primary reason for the creation of nano-features. Also, we utilized the near-field enhancement around nanoridges and nanotips upon pulsed laser irradiation to produce line or dot patterns in nanoscale on gold thin films deposited on glass substrates. We demonstrated that the photolithography can be extended to a sub-wavelength resolution for patterning any substrate by exciting the surface plasmons on both metallic mask and a shield layer covering the substrate. We used laser-assisted photothermal imprinting method for directly nanopatterning carbon nanofiber-reinforced polyethylene nanocomposite.

Paper Details

Date Published: 23 February 2006
PDF: 8 pages
Proc. SPIE 6107, Laser-based Micropackaging, 61070F (23 February 2006); doi: 10.1117/12.648735
Show Author Affiliations
Arvind Battula, The Univ. of Texas at Austin (United States)
Dongbing Shao, The Univ. of Texas at Austin (United States)
Yi Lu, The Univ. of Texas at Austin (United States)
Shaochen Chen, The Univ. of Texas at Austin (United States)


Published in SPIE Proceedings Vol. 6107:
Laser-based Micropackaging
Friedrich G. Bachmann; Willem Hoving; Yongfeng Lu; Kunihiko Washio, Editor(s)

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