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Proceedings Paper

Highly integrated plastic package transceiver modules for large core fiber systems
Author(s): Flora Ho; Wai Hung; Sing Cheng; Kenrick Fu; Elaine Wong; Kin Yau; Thomas Choi; Gomer Egnisaban; Tony Mangente; Torsten Wipiejewski
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Paper Abstract

We have developed fiber optic transceivers (FOT) based on leadframe and plastic molding technology for large core POF and PCS fiber systems. The leadframe style package exhibits a compact small size of 9.7mm x 6.2mm x 3.6mm. For PCS fiber system, the VCSEL based fiber optic transceivers have an operating wavelength at 850nm. The transmitter has an internal control circuit to stabilize the optical output of VCSEL and an integrated coupling optics to provide loose alignment tolerances of ±70μm in lateral axis for a working distance of 500μm to PCS optical fibers. The optical coupling power from the transmitter to the PCS fiber has a variation within 1dB over the wide ambient temperature range from -40oC to +105oC. Eye diagrams of the transceivers at 50Mbps are wide open over the normal operating temperature range from -40oC to +105oC. With a pair of VCSEL transmitter and MSM-PD receiver we achieve 1.25Gb/s transmission over 10m of PCS fiber. In a POF transmission system of 40m, over an operating temperature range from -40oC to +85oC, the fiber output power variation with the green LED transmitter is 1.5dB less than that with a similar red LED transmitter. The eye-diagrams of the green LED transmitter at 20Mbps are captured at back-to-back transmission and after 40m POF transmission.

Paper Details

Date Published: 28 February 2006
PDF: 11 pages
Proc. SPIE 6126, Photonics Packaging and Integration VI, 61260G (28 February 2006); doi: 10.1117/12.648004
Show Author Affiliations
Flora Ho, Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China)
Wai Hung, Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China)
Sing Cheng, Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China)
Kenrick Fu, Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China)
Elaine Wong, Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China)
Kin Yau, Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China)
Thomas Choi, Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China)
Gomer Egnisaban, Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China)
Tony Mangente, Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China)
Torsten Wipiejewski, Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong China)


Published in SPIE Proceedings Vol. 6126:
Photonics Packaging and Integration VI
Allen M. Earman; Ray T. Chen, Editor(s)

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