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Proceedings Paper

Ultra-deep plasma-assisted drilling of solids by high-power nanosecond lasers: experimental studies
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Paper Abstract

A new mechanism of ultra-deep (up to tens of microns per pulse, sub-mm total hole depths) plasma-assisted ablative drilling of optically opaque and transparent materials by high-power nanosecond lasers proposed by Kudryashov et al. has been studied experimentally using average drilling rate and photoacoustic measurements. In the drilling experiments, average multi-micron crater depth per laser shot and instantaneous recoil pressure of ablated products have been measured as a function of laser energy at constant focusing conditions using optical transmission and contact photo acoustic techniques, respectively. Experimental results of this work support the theoretical explanation of the ultra-deep drilling mechanism as a number of stages including ultra-deep "non-thermal" energy delivery by a short-wavelength radiation of the surface high-temperature ablative plasma, bulk heating and melting of these materials, accompanied by the following subsurface boiling in the melt pool and resulting melt expulsion off of the target.

Paper Details

Date Published: 23 February 2006
PDF: 9 pages
Proc. SPIE 6107, Laser-based Micropackaging, 610709 (23 February 2006); doi: 10.1117/12.647003
Show Author Affiliations
Stanley Paul, Arkansas State Univ. (United States)
Kevin Lyon, Arkansas State Univ. (United States)
Sergey I. Kudryashov, Arkansas State Univ. (United States)
Susan D. Allen, Arkansas State Univ. (United States)


Published in SPIE Proceedings Vol. 6107:
Laser-based Micropackaging
Friedrich G. Bachmann; Willem Hoving; Yongfeng Lu; Kunihiko Washio, Editor(s)

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