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Proceedings Paper

From magic to technology: materials integration by wafer bonding
Author(s): Viorel Dragoi
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Paper Abstract

Wafer bonding became in the last decade a very powerful technology for MEMS/MOEMS manufacturing. Being able to offer a solution to overcome some problems of the standard processes used for materials integration (e.g. epitaxy, thin films deposition), wafer bonding is nowadays considered an important item in the MEMS engineer toolbox. Different principles governing the wafer bonding processes will be reviewed in this paper. Various types of applications will be presented as examples.

Paper Details

Date Published: 24 February 2006
PDF: 15 pages
Proc. SPIE 6123, Integrated Optics: Devices, Materials, and Technologies X, 612314 (24 February 2006); doi: 10.1117/12.646450
Show Author Affiliations
Viorel Dragoi, EV Group (Austria)

Published in SPIE Proceedings Vol. 6123:
Integrated Optics: Devices, Materials, and Technologies X
Yakov Sidorin; Christoph A. Waechter, Editor(s)

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