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Proceedings Paper

Laser patterning and welding of transparent polymers for microfluidic device fabrication
Author(s): W. Pfleging; O. Baldus
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Paper Abstract

CO2-laser-assisted micro-patterning of polymethylmethacrylate (PMMA) or cyclo-olefin copolymer (COC) has a great potential for the rapid manufacturing of polymeric devices including cutting and structuring. Channel widths of about 50 μm as well as large area patterning of reservoir structures or drilling of vias are established. For this purpose a high quality laser beam is necessary as well as an appropriate beam forming system. In combination with laser transmission welding a fast fabrication of two- and three-dimensional micro-fluidic devices was possible. Welding as well as multilayer welding of transparent polymers was investigated for different polymers such as PMMA, polyvinylidene fluoride (PVDF), COC, and polystyrene (PS). The laser transmission welding process is performed with a high-power diode laser (wavelength 940 nm). An absorption layer with a thickness of several nanometers is deposited onto the polymer surfaces. The welding process has been established for the welding of polymeric parts containing microchannels, if the width of the channels is equal or larger than 100μm. For smaller feature sizes the absorption layer is structured by UV-laser radiation in order to get a highly localized welding seam, e.g., for the limitation of thermal penetration and thermal damaging of functional features such as channels, thin walls or temperature-sensitive substances often contained in micro-fluidic devices. This process strategy was investigated for the welding of capillary electrophoresis chips and capillary blood separation chips, including channel widths of 100 μm and 30 μm. Analysis of the thickness of the absorption layer was carried out with optical transmission spectroscopy.

Paper Details

Date Published: 23 February 2006
PDF: 12 pages
Proc. SPIE 6107, Laser-based Micropackaging, 610705 (23 February 2006); doi: 10.1117/12.646435
Show Author Affiliations
W. Pfleging, Forschungszentrum Karlsruhe GmbH (Germany)
O. Baldus, Forschungszentrum Karlsruhe GmbH (Germany)


Published in SPIE Proceedings Vol. 6107:
Laser-based Micropackaging
Friedrich G. Bachmann; Willem Hoving; Yongfeng Lu; Kunihiko Washio, Editor(s)

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