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Proceedings Paper

Hot gas stream application in micro-bonding technique
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Paper Abstract

This paper presents a new concept for bonding micro-parts with dimensions in the range of 50 μm to 300 μm. Two different kinds of adhesives - polyurethane adhesive foil and hot melt glue - were applied to a basic substrate by different techniques. The focused and concentrated hot gas stream softened glue which had been applied in a solid state. Micro-parts were then embossed in the softened glue, or covered and shielded by it. In this way, a rigid and compact bond was obtained after cooling. For the positioning of micro-parts (optical fibers), it has been necessary to manufacture adequate V-grooves. Finite element analyses using the ANSYSTM program package were performed in order to evaluate parameters which govern the heat transfer to the adhesive and substrate respectively. Experimental results are in good agreement with results obtained by the numerical simulations. The advantages of this new approach are small system size, low capital costs, simple usage, applicability to many material combinations, easy integration into existing production lines, etc.

Paper Details

Date Published: 6 January 2006
PDF: 8 pages
Proc. SPIE 6111, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V, 61110Q (6 January 2006); doi: 10.1117/12.644688
Show Author Affiliations
Daniela Andrijasevic, Vienna Univ. of Technology (Austria)
Ioanna Giouroudi, Vienna Univ. of Technology (Austria)
Walter Smetana, Vienna Univ. of Technology (Austria)
Stefan Boehm, Technical Univ. of Braunschweig (Germany)
Werner Brenner, Vienna Univ. of Technology (Austria)


Published in SPIE Proceedings Vol. 6111:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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