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Proceedings Paper

Optimization of laser microsoldering and microwelding processes by modeling of joints kinetics formation
Author(s): Alexander Allas; Victor Novosadov; Vadim Veiko
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Paper Abstract

The phenomenological model of laser joining at so called boundary kitetic is developed. The criteria of microjoints strength is suggested. As a result of kinetics of computer simulation of soldered joints forming, practical investigations of soldering modes influence at the joints strength and analysis of micro section metallographic specimens fulfilled with the aid of electronic microscope, the possibility of two-three fold enhancement of soldered joints strength in comparison with manual soldering. Technological process and automated equipment are developed for laser soldering of electronic components with planar leads at the printed circuit boards.

Paper Details

Date Published: 1 March 2006
PDF: 8 pages
Proc. SPIE 6107, Laser-based Micropackaging, 610707 (1 March 2006); doi: 10.1117/12.643767
Show Author Affiliations
Alexander Allas, TRIZ Ctr. Tvortchestvo Ltd. Co. (Russia)
Victor Novosadov, Moscow Academy of Food Production (Russia)
Vadim Veiko, St. Petersburg State Univ. of Information Technologies Mechanics & Optics (Russia)


Published in SPIE Proceedings Vol. 6107:
Laser-based Micropackaging
Friedrich G. Bachmann; Willem Hoving; Yongfeng Lu; Kunihiko Washio, Editor(s)

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