Share Email Print
cover

Proceedings Paper

Combined low-coherence interferometry and spectrally resolved reflectometry for nondestructive characterization of small-diameter high-aspect ratio micro-fabricated and micro-machined structures and multilayer membranes
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We propose novel tool employing both low coherence interferometer and spectrally resolved reflectometer sensor. We discuss application of this novel tool for measurements of the narrow high aspect ratio structures. We demonstrate that the visible reflectance spectrum of such structures allows us to extend range of interferometer to measure depth trenches with diameter from 2 μm to 1 mm, with reproducibility 10 nm - 100 nm depending on range of the thin film thickness. We also present of this novel tool for measurement of ultra-thin coated pressure sensor membranes. Application of an auxiliary spectral reflectometer allows correcting for systematic errors of low coherence interferometer which can be as large as 1.5 - 2 μm.

Paper Details

Date Published: 23 January 2006
PDF: 8 pages
Proc. SPIE 6109, Micromachining and Microfabrication Process Technology XI, 61090J (23 January 2006); doi: 10.1117/12.639267
Show Author Affiliations
Wojciech J. Walecki, Frontier Semiconductor Inc. (United States)
Talal Azfar, Frontier Semiconductor Inc. (United States)
Alexander Pravdivstev, Frontier Semiconductor Inc. (United States)
Manuel Santos, Frontier Semiconductor Inc. (United States)
Ann Koo, Frontier Semiconductor Inc. (United States)


Published in SPIE Proceedings Vol. 6109:
Micromachining and Microfabrication Process Technology XI
Mary-Ann Maher; Harold D. Stewart; Jung-Chih Chiao, Editor(s)

© SPIE. Terms of Use
Back to Top