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Proceedings Paper

Self-assembly micro optical filter
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Paper Abstract

Optical communication and sensor industry face critical challenges in manufacturing for system integration. Due to the assembly complexity and integration platform variety, micro optical components require costly alignment and assembly procedures, in which many required manual efforts. Consequently, self-assembly device architectures have become a great interest and could provide major advantages over the conventional optical devices. In this paper, we discussed a self-assembly integration platform for micro optical components. To demonstrate the adaptability and flexibility of the proposed optical device architectures, we chose a commercially available MEMS fabrication foundry service - MUMPs (Multi-User MEMS Process). In this work, polysilicon layers of MUMPS are used as the 3-D structural material for construction of micro component framework and actuators. However, because the polysilicon has high absorption in the visible and near infrared wavelength ranges, it is not suitable for optical interaction. To demonstrate the required optical performance, hybrid integration of materials was proposed and implemented. Organic compound materials were applied on the silicon-based framework to form the required optical interfaces. Organic compounds provide good optical transparency, flexibility to form filters or lens and inexpensive manufacturing procedures. In this paper, we have demonstrated a micro optical filter integrated with self-assembly structures. We will discuss the self-assembly mechanism, optical filter designs, fabrication issues and results.

Paper Details

Date Published: 18 January 2006
PDF: 8 pages
Proc. SPIE 6038, Photonics: Design, Technology, and Packaging II, 603820 (18 January 2006); doi: 10.1117/12.638604
Show Author Affiliations
Ping Zhang, The Univ. of Texas at Arlington (United States)
Kevin Le, The Univ. of Texas at Arlington (United States)
Smitha Malalur-Nagaraja-Rao, The Univ. of Texas at Arlington (United States)
Lun-Chen Hsu, The Univ. of Texas at Arlington (United States)
J.-C. Chiao, The Univ. of Texas at Arlington (United States)


Published in SPIE Proceedings Vol. 6038:
Photonics: Design, Technology, and Packaging II
Derek Abbott; Yuri S. Kivshar; Halina H. Rubinsztein-Dunlop; Shanhui Fan, Editor(s)

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