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Proceedings Paper

Nanocontact printing of nonplanar substrate by using flexible h-PDMS stamp
Author(s): Jeongdai Jo; Kwang-Young Kim; Eung-Sug Lee; Byung-Oh Choi
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Paper Abstract

The nanocontact printing process of non-planar substrate was conducted on the substrate as coated with the metal thin film on which the mask's pattern was to be printed by using the flexible h-PDMS stamp. In this study, in order to embody non-planar nanocontact print, the following types of nanostructures which were respectively different in a pattern form, a pattern size and a line width: a straight line type, an oblique line type, an L type and an U type. The mask size is 5 x 5 x 0.9 inch, and the pattern form size is 100nm ~ 500nm where the line width ratio and the pattern space are different and the depth is 200nm. The flexible h-PDMS stamp was fabricated by using VDT-731, SIP 6831.1, Fluka 87927 and HMS-301 as a mold material. The flexible h-PDMS stamp with a high resolution corresponds exactly to the master pattern, and could be replicated a pattern up to the size of 100nm. Also, in the surface characteristic, as a result of measuring the wettability, it could be known that the h-PDMS stamp has the surface characteristic of the hydrophobic and surface energy. The adhesion force and the friction force were very low. In the nanocontact printing of non-planar substrates experiment, a substrate of cylindrical on which the Cr adhesion layer of 100Å and the Au etching layer of 500Å were deposited by using the DC sputter and a substrate of ellipsoidal on which the Ti adhesion layer of 100Å and the Pd etching layer of 500Å were deposited in the form of a thin film, were fabricated, and a pattern was transferred to the substrates where to print by the flexible h-PDMS stamp wet with the SAM solution, and nanostructures had a high resolution without any defect could be fabricated. Also, we are seeking for its applicability to a organic electronic device, flexible electronic display, biological electronic device and the like by optimizing the nanocontact printing process.

Paper Details

Date Published: 4 January 2006
PDF: 7 pages
Proc. SPIE 6037, Device and Process Technologies for Microelectronics, MEMS, and Photonics IV, 60371T (4 January 2006); doi: 10.1117/12.638436
Show Author Affiliations
Jeongdai Jo, Korea Institute of Machinery and Materials (South Korea)
Kwang-Young Kim, Korea Institute of Machinery and Materials (South Korea)
Eung-Sug Lee, Korea Institute of Machinery and Materials (South Korea)
Byung-Oh Choi, Korea Institute of Machinery and Materials (South Korea)


Published in SPIE Proceedings Vol. 6037:
Device and Process Technologies for Microelectronics, MEMS, and Photonics IV
Jung-Chih Chiao; Andrew S. Dzurak; Chennupati Jagadish; David V. Thiel, Editor(s)

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