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Proceedings Paper

Concept design of a novel tactile probe tip for down scaled 3D CMMs
Author(s): H. Ji; L. X. Kong; H. Y. Hsu; A. B. Wedding; G.C. I. Lin; K. C. Fan
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Paper Abstract

Although coordinate metrology has reached a very high state of development concerning versatility and accuracy for common engineering parts, a high precision capability with nano scale resolution and accuracy is often hard to achieve when it is required to measure very small parts and features. The limiting component is the bulky probing system of traditional CMMs (coordinate measuring machines). In order to satisfy increasing demand for highly accurate geometrical measurements on small parts and small structures, a new measuring probe of high sensitivity and small geometrical dimension with low contact forces needs to be developed. In this paper, a novel probing system, which combines a FBG (Fibre Bragg Grating) embedded optical fibre tactile probe with an optical sensing technique, has been proposed. With the sensor elements integrated into the probe tip directly, the system sensitivity can be increased significantly. A preliminary theoretical analysis of the sensitivity of the FBG fibre sensor under axial and lateral end point loading has been presented and the results show that this micro scale probe has great potential to realize a resolution of 1nanometer on geometrical measurement of small parts.

Paper Details

Date Published: 29 December 2005
PDF: 8 pages
Proc. SPIE 6037, Device and Process Technologies for Microelectronics, MEMS, and Photonics IV, 60370Q (29 December 2005); doi: 10.1117/12.638223
Show Author Affiliations
H. Ji, Univ. of South Australia (Australia)
L. X. Kong, Univ. of South Australia (Australia)
H. Y. Hsu, Univ. of South Australia (Australia)
A. B. Wedding, Univ. of South Australia (Australia)
G.C. I. Lin, Univ. of South Australia (Australia)
K. C. Fan, National Taiwan Univ. (Taiwan)


Published in SPIE Proceedings Vol. 6037:
Device and Process Technologies for Microelectronics, MEMS, and Photonics IV
Jung-Chih Chiao; Andrew S. Dzurak; Chennupati Jagadish; David V. Thiel, Editor(s)

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