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Proceedings Paper

Electroless nickel applied in IRFPA interconnection
Author(s): Xiaomei Zhao; Sihai Chen; Xiaochao Fu; Xiting Shi; Shaowei He; Xinjian Yi
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Proc. SPIE 6038, Photonics: Design, Technology, and Packaging II, ; doi: 10.1117/12.638156
Show Author Affiliations
Xiaomei Zhao, Huazhong Univ. of Science and Technology (China)
Sihai Chen, Huazhong Univ. of Science and Technology (China)
Xiaochao Fu, Huazhong Univ. of Science and Technology (China)
Xiting Shi, Huazhong Univ. of Science and Technology (China)
Shaowei He, Huazhong Univ. of Science and Technology (China)
Xinjian Yi, Huazhong Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 6038:
Photonics: Design, Technology, and Packaging II
Derek Abbott; Yuri S. Kivshar; Halina H. Rubinsztein-Dunlop; Shanhui Fan, Editor(s)

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