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Proceedings Paper

Three-dimensional chip-scale optical interconnects and switches with self-organized wiring based on device-embedded waveguide films and molecular nanotechnologies
Author(s): Tetsuzo Yoshimura; Yoshiyuki Suzuki; Noriyuki Shimoda; Toshiaki Kofudo; Keiichi Okada; Yukihiko Arai; Kunihiko Asama
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Paper Abstract

We review our strategy toward chip-scale optical interconnect/switching with nano-scale packaging. A threedimensional optoelectronic (3-D OE) platform "System in S-FOLM" consisting of stacked OE films with embedded thin-film devices provides multilayer OE boards, 3-D stacked OE LSIs, 3-D optical switching systems, and so on. OE Amplifier/Driver-Less Substrate (OE-ADLES), where E-O and O-E conversions are respectively carried out by light modulators directly-driven by LSI output and by photodetectors directly-generating LSI input, reduces power dissipation and increases data rate in the platform. To realize the 3-D OE platform, waveguide films with surface-normal mirrors, resource-saving heterogeneous integration, 3-D optical wiring, and nano optical ICs and their mass production processes are required. These will be achieved our five original core technologies: the built-in mask method, PL-Pack with SORT, SOLNET, the molecular-controlled growth, and MND. The FDTD simulation reveals that in nano optical ICs of photonic crystals ~0.6-ps delay arises to complete lightwave interferences and confine lightwaves into waveguide regions. In addition, the molecular-controlled growth may enable future molecular transistor circuits.

Paper Details

Date Published: 28 February 2006
PDF: 15 pages
Proc. SPIE 6126, Photonics Packaging and Integration VI, 612609 (28 February 2006); doi: 10.1117/12.637582
Show Author Affiliations
Tetsuzo Yoshimura, Tokyo Univ. of Technology (Japan)
Yoshiyuki Suzuki, Tokyo Univ. of Technology (Japan)
Noriyuki Shimoda, Tokyo Univ. of Technology (Japan)
Toshiaki Kofudo, Tokyo Univ. of Technology (Japan)
Keiichi Okada, Tokyo Univ. of Technology (Japan)
Yukihiko Arai, Tokyo Univ. of Technology (Japan)
Kunihiko Asama, Tokyo Univ. of Technology (Japan)


Published in SPIE Proceedings Vol. 6126:
Photonics Packaging and Integration VI
Allen M. Earman; Ray T. Chen, Editor(s)

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