Share Email Print

Proceedings Paper

Ni-electroplating of double-width micro-cantilever
Author(s): Yifang Liu; Daoheng Sun; Mingliang Wang; WenLong Lv
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Micro-electroplating technology has an increasingly wider application in the fabrication of MEMS devices. In order to fabricate a double-width cantilever beam which has three different electroplated areas. The proper composition of the bath solution is obtained through experiments firstly in the paper. Then the effects of the peak of current density, duty cycle and pause time on the surface morphology of the electroplated nickel are studied experimentally to make sure the regulating range of pulsed parameters. And at last the double-width cantilever beam is fabricated using lithographic, micro-electroplating and sacrificial layer releasing processes. The results show that the surface of the beam is bright and smooth, and the nucleation rate increases steadily. But the thickness of the three parts with different width is different which can be modified by increasing the duty cycle and reducing the current density to some extent.

Paper Details

Date Published: 23 January 2006
PDF: 8 pages
Proc. SPIE 6109, Micromachining and Microfabrication Process Technology XI, 61090L (23 January 2006); doi: 10.1117/12.637455
Show Author Affiliations
Yifang Liu, Xiamen Univ. (China)
Daoheng Sun, Xiamen Univ. (China)
Mingliang Wang, Xiamen Univ. (China)
WenLong Lv, Xiamen Univ. (China)

Published in SPIE Proceedings Vol. 6109:
Micromachining and Microfabrication Process Technology XI
Mary-Ann Maher; Harold D. Stewart; Jung-Chih Chiao, Editor(s)

© SPIE. Terms of Use
Back to Top