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Proceedings Paper

DUV water immersion technology extends linearity: first results from the new 65nm node CD metrology system LWM500 WI
Author(s): Frank Hillmann; Stefan Dobereiner; Christian Gittinger; Richard Reiter; Gunther Falk; Hans-Jurgen Bruck; Gerd Scheuring; Artur Bosser; Michael Heiden; Gerhard Hoppen; Wolfgang Sulik; Wolfgang Vollrath
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Paper Abstract

The increased requirements on reticles for the 65nm technology node with respect to CD homogeneity and CD mean to target requirements call for a metrology system with adequate measurement performance. We report on the new water immersion technique and the system concept of the worlds first optical CD metrology system based on this technology. The core of it is a new DUV immersion objective with a NA of 1.2, using illumination at a wavelength of 248nm. The largest challenge of the water immersion technology was the fluid handling. The key compo-nents, a water injection and removal unit, developed by MueTec, solve this issue. To avoid contaminations the purified DI water is micro-filtered. An environmental chamber guarantees extremely stable measurement conditions. The advantages of optical CD measurements in transmitted light compared to CD-SEM is shown. With this system, already installed, excellent results for short- and longterm repeatability for both linewidth and contact measurements were achieved on COG, KrF HT and ArF HT masks. The linearity range of the system is extended down to 220nm. A comparison of CD measurements between the different tool generations such as the Leica LWM250/270 DUV at 248nm with a NA of 0.9 is shown. An outlook on the future potentials of optical mask CD metrology finalises this report.

Paper Details

Date Published: 16 June 2005
PDF: 11 pages
Proc. SPIE 5835, 21st European Mask and Lithography Conference, (16 June 2005); doi: 10.1117/12.637295
Show Author Affiliations
Frank Hillmann, MueTec GmbH (Germany)
Stefan Dobereiner, MueTec GmbH (Germany)
Christian Gittinger, MueTec GmbH (Germany)
Richard Reiter, MueTec GmbH (Germany)
Gunther Falk, MueTec GmbH (Germany)
Hans-Jurgen Bruck, MueTec GmbH (Germany)
Gerd Scheuring, MueTec GmbH (Germany)
Artur Bosser, Leica Microsystems Semiconductor GmbH (Germany)
Michael Heiden, Leica Microsystems Semiconductor GmbH (Germany)
Gerhard Hoppen, Leica Microsystems Semiconductor GmbH (Germany)
Wolfgang Sulik, Leica Microsystems Semiconductor GmbH (Germany)
Wolfgang Vollrath, Leica Microsystems Semiconductor GmbH (Germany)


Published in SPIE Proceedings Vol. 5835:
21st European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

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