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Proceedings Paper

Silicon ULSI systems: a new communications challenge for optoelectronics
Author(s): Stuart K. Tewksbury
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Paper Abstract

Electronic system U3iflfl ULSI wi11 be based on ultrasmall features for ULSI monolithic circuits and on small f eatures for advanced packaging such as multi-chip modules (MCMs). These reduced interconnection cross sections are needed to achieve very high density circuits but may conflict with achieving very high data rates across thos e interconnections. Optical interconnections may provide both very high density interconnections and very high speed data rates. Most comparisons of optical with electrical inter. onnection emphasize the high speed bipolar circuits rather than the high density CMOS circuits. However within VLSI/ULSI systems CMOS interconnections are quite different from and offer several advantages (particularly lower power dissipation at the system level) over bipolar LSI interconnections. The role of optical interconnects is viewed here from the perspective of the CMOS interconnection environment. L

Paper Details

Date Published: 16 December 1992
PDF: 5 pages
Proc. SPIE 1622, Emerging Optoelectronic Technologies, (16 December 1992); doi: 10.1117/12.636845
Show Author Affiliations
Stuart K. Tewksbury, West Virginia Univ. (United States)


Published in SPIE Proceedings Vol. 1622:
Emerging Optoelectronic Technologies
Krishna Shenai; Ananth Selvarajan; C. Kumar N. Patel; C. N. R. Rao; B. S. Sonde; Vijai K. Tripathi, Editor(s)

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