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Proceedings Paper

Microwave packaging for 10-Gb/s EML modulators
Author(s): Yu Liu; Liang Xie; Haiqing Yuan; Jiabao Zhang; Ninghua Zhu; Changzheng Sun; Bing Xiong; Yi Luo
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Paper Abstract

A novel microwave packaging technique for 10Gb/s electro-absorption modulator integrated with distributed feedback laser (EML) is presented. The packaging parasitics and intrinsic parasitics are both well considered, and the packaging circuit was synthetically designed to compensate for the intrinsic parasitic of the chip. A butterfly-packaged EML module has been successfully developed to prove that. The small-signal modulation bandwidth of the butterfly-packaged module is about 10 GHz. Optical fiber transmission experiments have shown that the module can be used for 10Gb/s optical transmission system. After transmission through 40km, the power penalty is less than 1 dBm at a bit-error-rate of 10-12.

Paper Details

Date Published: 3 December 2005
PDF: 5 pages
Proc. SPIE 6020, Optoelectronic Materials and Devices for Optical Communications, 60201O (3 December 2005); doi: 10.1117/12.636469
Show Author Affiliations
Yu Liu, Institute of Semiconductors (China)
Liang Xie, Institute of Semiconductors (China)
Haiqing Yuan, Institute of Semiconductors (China)
Jiabao Zhang, Institute of Semiconductors (China)
Ninghua Zhu, Institute of Semiconductors (China)
Changzheng Sun, Tsinghua Univ. (China)
Bing Xiong, Tsinghua Univ. (China)
Yi Luo, Tsinghua Univ. (China)


Published in SPIE Proceedings Vol. 6020:
Optoelectronic Materials and Devices for Optical Communications
Shinji Tsuji; Jens Buus; Yi Luo, Editor(s)

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