Share Email Print
cover

Proceedings Paper

Design and Fabrication of Low-microwave loss Coplannar Waveguide and precise V groove on Silicon Substrate for Optoelectronic Packaging
Author(s): Hua Yang; Hongliang Zhu; Hongyun Xie; Lingjuan Zhao; Fan Zhou; Wei Wang
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Optoelectronic packaging has become a most important factor that influences the final performance and cost of the module. In this paper, low microwave loss coplanar waveguide(CPW) on high resistivity silicon(HRS) and precise V groove in silicon substrate were successfully fabricated. The microwave attenuation of the CPW made on HRS with the simple process is lower than 2 dB/cm in the frequency range of 0~26GHz, and V groove has the accuracy in micro level and smooth surface.These two techniques built a good foundation for high frequency packaging and passive coupling of the optoelectronic devices. Based on these two techniques, a simple high resistivity silicon substrate that integrated V groove and CPW for flip-chip packaging of lasers was completed. It set a good example for more complicate optoelectronic packaging.

Paper Details

Date Published: 3 December 2005
PDF: 8 pages
Proc. SPIE 6019, Passive Components and Fiber-based Devices II, 601938 (3 December 2005); doi: 10.1117/12.635519
Show Author Affiliations
Hua Yang, Institute of Semiconductors (China)
Hongliang Zhu, Institute of Semiconductors (China)
Hongyun Xie, Institute of Semiconductors (China)
Lingjuan Zhao, Institute of Semiconductors (China)
Fan Zhou, Institute of Semiconductors (China)
Wei Wang, Institute of Semiconductors (China)


Published in SPIE Proceedings Vol. 6019:
Passive Components and Fiber-based Devices II
Yan Sun; Jianping Chen; Sang Bae Lee; Ian H. White, Editor(s)

© SPIE. Terms of Use
Back to Top