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Proceedings Paper

ALD as enabling technology for the next generation of microprocessors
Author(s): Adrien R. Lavoie; Val Dubin
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Paper Abstract

As dimensions of microprocessor components continue to shrink, new and enabling technologies are required to enable the next generation of (sub)nanometer size features and components. With this aim, the industry has long aspired to gain molecular and even atomic-level control over architectural assembly. Building from the basic principles of chemistry and physics, one of today's technological forefronts in self-assembly and atomic-scale placement is being realized via ALD. Herein, the advances in ALD/CVD with a focus on BEOL interconnect development will be reviewed. Architectural, materials, and integration platforms (barrier, adhesion, seed) will be reviewed. Industrial challenges will be addressed and leading strategies will be considered. Finally, the latest results involving methods and materials will be presented.

Paper Details

Date Published: 16 November 2005
PDF: 9 pages
Proc. SPIE 6002, Nanofabrication: Technologies, Devices, and Applications II, 60020J (16 November 2005); doi: 10.1117/12.634884
Show Author Affiliations
Adrien R. Lavoie, Intel Corp. (United States)
Val Dubin, Intel Corp. (United States)


Published in SPIE Proceedings Vol. 6002:
Nanofabrication: Technologies, Devices, and Applications II
Warren Y.-C. Lai; Leonidas E. Ocola; Stanley Pau, Editor(s)

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