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New processing possibilities of materials by micro and nano precision laser machining for microelectronics applications
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Paper Abstract

The permanently development of microelectronics production by continuously increasing of devices densities meantime with corresponding decreasing of processing line till further submicronic range. The processing of huge diversity of materials as metals, polymers, ceramics, silicon, germanium, other materials III-Vs, glass, diamond, hard metal oxides, composites is need. On this paper will be presented our advanced studies and of experiments realized with very good results for a full range of those materials by micro and nanoprocessing for to realize the best accuracy, according with microelectronics technical requirements specified as below: 1. The microdrilling for microvias used for MCM's, MEMS and MOEMS application. 2. The high precision microcutting and scribing used for individual chips separation Isingulation on processed wafers of micro and optoelectronics applications 3. 2D I3D processing for microlens, microlens array and microalveoles fabrication 4. Microengraving of KOP (Potasium dihydrogen phosphate) crystal by laser microablation 5. Micro and nano cleaning of thin and ultrathin layers need for production of microelectronics devices production.

Paper Details

Date Published: 7 June 2005
PDF: 12 pages
Proc. SPIE 5850, Advanced Laser Technologies 2004, (7 June 2005); doi: 10.1117/12.633706
Show Author Affiliations
Dumitru Ulieru, Romes S.A. (Romania)
Ileana Apostol, National Institute for Research and Development for Laser, Plasma and Radiation Physics (Romania)

Published in SPIE Proceedings Vol. 5850:
Advanced Laser Technologies 2004
Ivan A. Shcherbakov; Anna Giardini; Vitali I. Konov; Vladimir I. Pustovoy, Editor(s)

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