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Proceedings Paper

Technical summary for the Foundry Data eXchange system
Author(s): Christopher P. Braun; Gerry Krupka; Frederick R. Peiffer; Thomas A. Polk; Evelyn E. Roadcap; John M. Sosik; Gregory P. Van Allen; William Wilkinson
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Paper Abstract

Many companies are ramping their usage of third party wafer foundries for the manufacture of their integrated circuits. As such, new demands of data management and handoff are required. Maintaining a digital record and designing a digital interface with our foundry partners is critical to optimize the tape out and ramp to manufacturing processes. This paper describes the current development of Agere System's 'Foundry Data eXchange' system, which puts structure and consistency around the design data transfer and tape out process. The system streamlines the tapeout process and yields a consistent platform for all data handling. This will lead to greater efficiency and accuracy, saving time during the data handoff. In addition, the system lays the groundwork for the future application of an electronic data handoff with foundry partners.

Paper Details

Date Published: 8 November 2005
PDF: 11 pages
Proc. SPIE 5992, 25th Annual BACUS Symposium on Photomask Technology, 59923O (8 November 2005); doi: 10.1117/12.632243
Show Author Affiliations
Christopher P. Braun, Agere Systems Inc. (United States)
Gerry Krupka, Agere Systems Inc. (United States)
Frederick R. Peiffer, Agere Systems Inc. (United States)
Thomas A. Polk, Agere Systems Inc. (United States)
Evelyn E. Roadcap, Agere Systems Inc. (United States)
John M. Sosik, Agere Systems Inc. (United States)
Gregory P. Van Allen, Agere Systems Inc. (United States)
William Wilkinson, Agere Systems Inc. (United States)


Published in SPIE Proceedings Vol. 5992:
25th Annual BACUS Symposium on Photomask Technology
J. Tracy Weed; Patrick M. Martin, Editor(s)

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