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Proceedings Paper

Evaluation and implementation of TeraScan reflected light die-to-database inspection mode for 65nm design node process
Author(s): Luke T. H. Hsu; C.H. Ho; C. C. Lin; Vincent Hsu; Ellison Chen; Paul Yu; Kong Son
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Paper Abstract

The standard inspection flow typically consists of transmitted light pattern inspection (die-to-die or die-to-database) and STARlightTM (Simultaneous Transmitted And Reflective Light) contamination inspection. The initial introduction of TeraScan (DUV) inspection system was limited to transmitted pattern inspection modes. Hence, complete inspections of critical mask layers required utilizing TeraScan for maximized pattern defect sensitivity and the previous generation TeraStar (UV) for STARlightTM contamination inspection. Recently, the reflective light die-to-database (dbR) inspection mode was introduced on the DUV tool to compliment transmitted light die-to-database (dbT) inspection. The dbR inspection mode provides not only pattern inspection but also contamination inspection capabilities. The intent of this evaluation is to characterize the dbR inspection capability on pattern defects and contaminations. A series of standard programmed defect test plates will be used to evaluate pattern inspection capability and a PSL test plate will be used to determine the contamination performance. Inspection results will be compared to the current inspection process of record (dbT + STARlightTM). Lastly, the learning will be used to develop and implement an optimal dbR inspection flow for selected critical layers of the 65-nm node to meet the inspection criteria and minimize the cycle time.

Paper Details

Date Published: 4 November 2005
PDF: 8 pages
Proc. SPIE 5992, 25th Annual BACUS Symposium on Photomask Technology, 599207 (4 November 2005); doi: 10.1117/12.632108
Show Author Affiliations
Luke T. H. Hsu, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
C.H. Ho, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
C. C. Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Vincent Hsu, KLA-Tencor Corp. (Taiwan)
Ellison Chen, KLA-Tencor Corp. (Taiwan)
Paul Yu, KLA-Tencor Corp. (United States)
Kong Son, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 5992:
25th Annual BACUS Symposium on Photomask Technology
J. Tracy Weed; Patrick M. Martin, Editor(s)

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