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Proceedings Paper

Approaching zero etch bias at Cr etch process
Author(s): Pavel Nesladek; Norbert Falk; Andreas Wiswesser; Renee Koch; Björn Sass
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Paper Abstract

Increasing demand for high end lithography mask especially phase shift masks and narrowing the specification, lead to development of etch processes with minimum critical dimension uniformity (CDU) and very low etch bias. The etch bias becomes one of the limiting parameters for the Cr etch process, due to strong cross links between etch bias and other etch characteristics like linearity and loading effect, thus contributing strongly to the CDU for masks with non uniform pattern distribution. The goal was to develop a Cr etch process with very low etch bias, keeping the other parameters at the same level and providing a wider process window for further optimization of the CDU, loading effect and linearity. In the paper we want to present a feasibility study of one specific approach to the mentioned methods and compare different ways for measurement of the CDU and etch bias. The work presented was done on the Applied Materials Tetra II Mask Etch system.

Paper Details

Date Published: 4 November 2005
PDF: 9 pages
Proc. SPIE 5992, 25th Annual BACUS Symposium on Photomask Technology, 59920N (4 November 2005); doi: 10.1117/12.631718
Show Author Affiliations
Pavel Nesladek, Advanced Mask Technology Ctr. (Germany)
Norbert Falk, Applied Materials, Inc. (United States)
Andreas Wiswesser, Advanced Mask Technology Ctr. (Germany)
Renee Koch, Applied Materials, Inc. (United States)
Björn Sass, Advanced Mask Technology Ctr. (Germany)


Published in SPIE Proceedings Vol. 5992:
25th Annual BACUS Symposium on Photomask Technology
J. Tracy Weed; Patrick M. Martin, Editor(s)

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